Multilayer PCB Has A lot more Than Two Conductive Copper Layers

Multilayer PCB has more than 2 conductive copper layers which mainly comprise of inner level cores, prepreg layers and copper foils and they? lso are melted together through heat and strain. Lamination process is one of the key to manage top quality of multilayer PCB, this method requires specific heating system and pressure for specific amounts of time dependent on materials used to ensure the PCB board is manufactured properly.

The multilayer PCB is typically the development of the particular double sided PCB with increasing difficulty and density regarding components, they granted the designers to produce highly complex and compact brake lines and further growth of blind in addition to buried via gap technology has pressed these limits even further.

With the requirements of larger precision in various applications, the demands regarding multilayer PCB maintain increasing continuously in recent years. The typical applications of multilayer published circuit boards contain Computers, Data storage space, Cell phone transmission, GPS technology, satellite systems and therefore on.

A-TECH is usually an experienced multilayer PCB manufacturer which usually own complete multilayer PCB manufacturing method in house coming from inner layer, vacuum lamination to surface area finishes, it brings us more positive aspects in the competitors of global industry shares for multilayer printed circuit boards on quality, price and lead time. The proportion associated with multilayer PCB we all manufactured is more than 65%.

HDI PCB, the entire title is Very dense Connect PCB, it takes a lot higher wiring density with finer trace and spacing, more compact vias and increased connection pad density. Blind and hidden vias? design any of their designated feature. HDI PCB are widely used for Cellular phone, tablet computer, digital camera, GPS, LCD module plus other different region.

A-TECH CIRCUITS provides HDI PCB manufacturing services to worldwide customers in the top end automotive industry, medical electronic device market, mobile, computing and defense industry.

At present the advanced HDI technology we applied include: “Direct Laserlight Drill”(DLD) is going of copper layer by direct CO2 laser irradiation, out-do additional laser going with conformal mask, the copper immediate laser drilling is capable of providing increased accuracy, better opening quality and far better efficiency for HDI projects. multilayer pcb “Copper Filled” for special collection microvia, “Laser Primary Imaging”(LDI) is especially designed for good line technology, to be able to eliminate dimensional stability problem of art caused by environmental and material issues.